Camera hot melt film

Camera hot melt film

The reactive jsw-Camera hot melt film is heated and melted into a fluid under the condition of inhibiting chemical reaction to facilitate coating; the adhesive layer agglomerates after two kinds of adherends are bonded and cooled; after Camera hot melt film reacts with and expands the chain with the help of the moisture in the air and the moisture on the surface of the adherend to form a polymer with high cohesion, making the adhesive force, heat resistance The resistance to low temperature was significantly improved. Because of its high reactivity, Camera hot melt film shows excellent adhesion to a variety of plastics, PMMA, acrylic, glass, metal and other materials. Camera hot melt film is used in the electronic and microelectronics industry, tablet frame and touch screen and other plastic substrate bonding. The above is a brief introduction of Camera hot melt film. For detailed data, please go to the download window of jinshengwei official website. The following is the informal information of Camera hot melt film for reference only. Window uses Camera hot melt film as adhesive, should be the largest infiltration area, and measure the roughness of the solid. If the surface roughness increases, the infiltration process can proceed spontaneously. Kinetics of Camera hot melt film infiltration and infiltration speed are related to the surface structure of adherend, adhesive viscosity and surface tension. Since the surface tension of organic solid will not differ greatly, the soaking time of Camera hot melt film mainly depends on the viscosity and contact angle of hot melt liquid. It can be seen from the above that the lower the viscosity of hot melt liquid is, the shorter the soaking time of Camera hot melt film is, and the gap on the surface will be fully soaked. The smaller, the faster the infiltration rate. The best condition for bonding surface chemistry is to obtain the best bonding strength when Camera hot melt film has the largest bonding work to the surface or the lowest interfacial energy. This is the best condition for bonding surface chemistry. Any modified Camera hot melt film can only form a good adhesive layer on a suitable surface. The general treatment method for the bonding surface is: for the surface with low requirements or relatively clean surface, the oil stain can be removed by solvent such as alcohol and acetone, and the bonding can be carried out after the cleaning agent volatilizes. The chemical treatment method of Camera hot melt film bonding surface is: some metals should be pickled before bonding, such as aluminum alloy should be oxidized to form a firm oxide layer on its surface before bonding. The mechanical treatment method of Camera hot melt film bonding surface is to make some joints form rough surfaces mechanically to increase their contact area. In the joint design, the strength of Camera hot melt film can usually reach or exceed that of the bonding material itself, but due to the weak point of the joint, a certain margin should be considered when designing the joint. The use of Camera hot melt film, in electronic products, the TP screen, display screen and other connection parts in transportation and use, due to the action of vibration mechanical force will produce loose, poor contact or even open circuit, resulting in machine or system failure. Fixing with Camera hot melt film is a new assembly process, which has been widely used in electronic assembly in recent years due to its low cost, simple process and high reliability.